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Shenzhen Hongyunlai Electronic Technology Co. Ltd
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copper base board
Showing 1 - 3 of 3, total 1 pages [First] [Previous] [Next] [Last]
1
copper base board
Specification: cooper base board
Detail: surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. Layers£º1-4layer Maximum measurement£º500*650mm Molding dimension tolerance£º¡À0.15mm Delivery cycle£ºngle temp...
2
copper base board
Specification: cooper base board
Detail: surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. Layers£º1-4layer Maximum measurement£º500*650mm Molding dimension tolerance£º¡À0.15mm Delivery cycle£ºngle temp...
3
copper base board
Specification: cooper base board
Detail: surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. Layers£º1-4layer Maximum measurement£º500*650mm Molding dimension tolerance£º¡À0.15mm Delivery cycle£ºngle temp...
Showing 1 - 3 of 3, total 1 pages [First] [Previous] [Next] [Last]
1
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