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aluminum base board
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aluminum base pcb
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Shenzhen Hongyunlai Electronic Technology Co. Ltd
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1
pcba
Specification: pcba
Detail: Surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. layers:1-12layer maximum measurement:450mmx600mm minimum ***cing wire:0.1mm 4mil minimum thickness£º0.1mm 4mil ...
2
pcba
Specification: pcba
Detail: surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. Layers£º1-4layer Maximum measurement£º500*650mm Molding dimension tolerance£º¡À0.15mm Delivery cycle£ºngle temp...
3
pcba
Specification: pcba
Detail: Surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. layers:1-12layer maximum measurement:450mmx600mm minimum ***cing wire:0.1mm 4mil minimum thickness£º0.1mm 4mil ...
4
pcba
Specification: pcba
Detail: Surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. layers:1-12layer maximum measurement:450mmx600mm minimum ***cing wire:0.1mm 4mil minimum thickness£º0.1mm 4mil ...
5
aluminum base board
Specification: aluminum pcb
Detail: surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. Layers£º1-4layer Maximum measurement£º500*650mm Molding dimension tolerance£º¡À0.15mm Delivery cycle£ºngle temp...
6
aluminum base board
Specification: aluminum pcb
Detail: surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. Layers£º1-4layer Maximum measurement£º500*650mm Molding dimension tolerance£º¡À0.15mm Delivery cycle£ºngle temp...
7
aluminum base board
Specification: aluminum pcb
Detail: surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. Layers£º1-4layer Maximum measurement£º500*650mm Molding dimension tolerance£º¡À0.15mm Delivery cycle£ºngle temp...
8
aluminum base board
Specification: aluminum pcb
Detail: surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. Layers£º1-4layer Maximum measurement£º500*650mm Molding dimension tolerance£º¡À0.15mm Delivery cycle£ºngle temp...
9
aluminum base board
Specification: aluminum pcb
Detail: surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. Layers£º1-4layer Maximum measurement£º500*650mm Molding dimension tolerance£º¡À0.15mm Delivery cycle£ºngle temp...
10
glass fiber fr-4
Specification: FR-4
Detail: Surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. layers:1-12layer maximum measurement:450mmx600mm minimum ***cing wire:0.1mm 4mil minimum thickness£º0.1mm 4mil ...
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