Shenzhen Hongyunlai Electronic Technology Co. Ltd

Showing 11 - 17 of 17, total 2 pages [First] [Previous] [Next] [Last]

glass fiber fr-4
Specification: cooper base board
Detail: Surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. layers:1-12layer maximum measurement:450mmx600mm minimum ***cing wire:0.1mm 4mil minimum thickness£º0.1mm 4mil ...

glass fiber fr-4
Specification: FR-4
Detail: surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. Layers£º1-4layer Maximum measurement£º500*650mm Molding dimension tolerance£º¡À0.15mm Delivery cycle£ºngle temp...

copper base board
Specification: cooper base board
Detail: surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. Layers£º1-4layer Maximum measurement£º500*650mm Molding dimension tolerance£º¡À0.15mm Delivery cycle£ºngle temp...

aluminum base board
Specification: Aluminum substrate copper clad
Detail: surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. Layers£º1-4layer Maximum measurement£º500*650mm Molding dimension tolerance£º¡À0.15mm Delivery cycle£ºngle temp...

fr-4
Specification: Glass fiber board FR-4
Detail: Surface treatment:OSP,immersion Gold,Immersion Tin,Immersion silver,Lead Free Air Leveing,ickel -Gold plating. layers:1-12layer maximum measurement:450mmx600mm minimum ***cing wire:0.1mm 4mil minimum thickness£º0.1mm 4mil ...


Showing 11 - 17 of 17, total 2 pages [First] [Previous] [Next] [Last]
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